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◎ Ball placement system for substrate strip carrier

◎ Applicable package: FBGA, PBGA& Flip chip

◎ Substrate format:
   Carrier boat (Single unit:12x12mm2-50x50mm2)
   Substrate strip (50-77.5mm(W) x200-260mm(L)

◎ Footprint:2150mm(L)x1400mm(W)x1800(H)

◎ Foot weight:2500kg

◎ Placement accuracy: ±50um

◎ Fine pitchcapability;0.450mm ball pitch/0.280mm ball diameter 

◎ Yield:99.95%

◎ Cycle time: 16sec

◎ Changeover time: Smart tool kit design for easier device change