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BPS-6200
特点和优势
◎ Ball placement system for substrate strip carrier
◎ Applicable package: FBGA, PBGA& Flip chip
◎ Substrate format:
Carrier boat (Single unit:12x12mm2-50x50mm2)
Substrate strip (50-77.5mm(W) x200-260mm(L)
Carrier boat (Single unit:12x12mm2-50x50mm2)
Substrate strip (50-77.5mm(W) x200-260mm(L)
◎ Footprint:2150mm(L)x1400mm(W)x1800(H)
◎ Foot weight:2500kg
◎ Placement accuracy: ±50um
◎ Fine pitchcapability;0.450mm ball pitch/0.280mm ball diameter
◎ Yield:99.95%
◎ Cycle time: 16sec
◎ Changeover time: Smart tool kit design for easier device change